
Bent Silicon Detector Characterization for the ALICE Inner Tracking System Upgrade
Why do we need thin, bent sensors?
The ALICE (A Large Ion Collider Experiment) at the CERN LHC investigates the properties of the Quark-Gluon Plasma (QGP), the extremely hot and dense state of matter believed to have existed microseconds after the Big Bang. A central handle on QGP is the behaviour of heavy-flavour (Charm and Beauty) quarks that traverse the medium produced in heavy-ion collisions.
Just like throwing a heavy bowling ball into a foggy room to determine the fog's density from its trail, these heavy quarks act as that allow us to figure out the properties of the QGP.
However, hadrons containing these heavy quarks have extremely short proper lifetimes (e.g. the D⁰ meson has cτ ≈ 123 μm), so reconstructing their decay vertices separately from the primary interaction vertex demands a precision tracker placed as close as possible to the beam pipe, with as little material as possible.
This role is played by the Inner Tracking System (ITS). During LHC Long Shutdown 3 (2026–2028), the three innermost layers of the present ITS2 (Inner Barrel) will be replaced by ITS3, a next-generation tracker built from wafer-scale, stitched MAPS fabricated in TPSCo 65 nm CMOS technology, thinned to below 50 μm and bent around the beam pipe into truly cylindrical half-layers.
A flat, single piece of silicon is very thin and weak, making it difficult to maintain its shape on its own under the influence of gravity without additional structures, but when rolled into an arch shape, it becomes sturdy. Utilizing this allows the sensors to keep their cylindrical shape held only by carbon-foam supports and air cooling — without any liquid cooling pipes inside the active acceptance.
Thanks to this, the in the innermost layer is reduced to about 0.05% X₀ per layer, roughly a factor of seven lower than the ITS2 Inner Barrel (~0.35% X₀).
As a result, the of low-momentum particles is strongly suppressed, and the pointing (impact-parameter) resolution is expected to improve by roughly a factor of two compared to ITS2.
How to connect and operate thin, flexible sensors?
Once thin silicon sensors that bend to gain geometric stiffness were devised, the next challenge was how to supply power and retrieve data from them. To solve this, the Flexible Printed Circuit (FPC) serves as the backbone for establishing physical and electrical connections.

The photo on the left shows the actual setup where the ALPIDE sensor is bonded to the FPC (Flexible Printed Circuit).
This FPC is made of thin and flexible material, which stably maintains electrical connections when realizing the 'bent sensor,' the core goal of ITS3. Additionally, it plays a pivotal role in supplying power and transmitting high-speed data by connecting the sensor to the FPGA-based Interface Board.
Precision hardware design for validating bent sensor performance
As a member of Pusan National University's Heavy Ion Physics Experiment Lab (HIPEx), I participated in the ALICE Collaboration's ITS3 WP4 (Mechanics & Engineering) research. ALPIDE — the 180 nm CMOS MAPS already in service in ITS2 — has a chip area of ≈ 30 × 15 mm² with a 512 × 1024 pixel matrix (524,288 pixels, pitch ≈ 29 × 27 μm). As a precursor to ITS3's next-generation 65 nm wafer-scale stitched MAPS, our work focused on verifying that thinned ALPIDE chips (50 μm and 100 μm) tolerate the mechanical stress of being bent to the ITS3 target radii (18 mm, 24 mm, 30 mm) without measurable degradation in their pixel response.
To achieve this, the first problem to solve was, "How can we precisely bend and secure a paper-thin silicon sensor to the desired radius without breaking it?" I built the test environment by designing 'PNU Guide & Frame', a custom mechanical jig assembly in 3D CAD, and 3D printing it. This allowed us to bend the sensor-FPC assembly safely while keeping the bending radius repeatable across measurement runs.

This shows a 50μm thick ALPIDE sensor rolled up and secured using the custom-designed PNU Guide & Frame. In this state, the threshold and noise levels of the sensor were measured and compared to the flat state.
Established a stable test setup that allowed for the repeated process of accurately bending the ALPIDE chip to the desired curvatures (18, 24, 30mm) and flattening it again without causing physical damage.
Measured and mapped the signal detection baseline (Threshold) and Noise distributions of each pixel before and after bending. The core goal was to discern if stress triggers an increase in Fake Hits.
Statistically processed and visualized over 500,000 pixel datasets using C++ and the ROOT framework to track the impact of the bending stress, especially near the matrix edges.
Identifying the cause of sensor measurement anomalies in IR environments
During a sensor beamtime test at the Korea Multi-purpose Accelerator Complex (KOMAC) proton accelerator in Gyeongju, we observed persistent, unexplained anomalies (spurious hits) in the sensor data.
To diagnose the issue, I focused on the optical properties of silicon. Silicon at room temperature has an indirect bandgap of about 1.12 eV, which corresponds to a photon-absorption cutoff wavelength of about 1107 nm. In other words, near-infrared (Near-IR) photons with wavelength ≲ 1100 nm can be absorbed and generate electron-hole pairs that the pixel sees as ionization signal. Typical surveillance / night-vision IR LED CCTV cameras emit at 850 nm or 940 nm — well inside silicon's absorption window. I therefore hypothesized that the IR illuminator on the camera installed inside the irradiation room was reaching the thinned ALPIDE surface and producing fake hits and distortions in the threshold-scan distribution.
To verify this, I returned to the laboratory and intentionally illuminated the ALPIDE sensor with an IR LED inside a fully light-tight dark room. The same shifts in the threshold distribution and the same increase in fake hits seen at the accelerator were reproduced, confirming the IR-illumination hypothesis. This was a valuable experience of using first-principles physics knowledge to track down a non-obvious systematic effect in the field, rather than treating the anomalies as unexplained noise.
Within the bending radii we tested (18–30 mm), the thinned ALPIDE sensors themselves showed no significant change in noise or threshold between the flat and bent configurations — consistent with the ALICE published result of detection efficiency > 99.9% and spatial resolution ≈ 5 μm, independent of bending radius. Our practical conclusion was that controlling ambient light conditions (especially IR) is highly critical for the measurement itself. The PNU bending campaign was paused when I started my mandatory military service, so the final group-level write-up was completed by other collaborators.
ALPIDE, the Monolithic Active Pixel Sensor for the ALICE ITS upgrade
M. Mager (for the ALICE Collaboration)
Nuclear Instruments and Methods in Physics Research A 824 (2016) 434–438
First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
ALICE ITS Project
Nuclear Instruments and Methods in Physics Research A 1028 (2022) 166280
Testbeam performance results of bent ALPIDE Monolithic Active Pixel Sensors in view of the ALICE Inner Tracking System 3
ALICE ITS3 Project
Journal of Instrumentation 17 (2022) C09006, arXiv:2112.10414
The ITS3 detector and physics reach of the LS3 ALICE Upgrade
C.-Z. Wang (for the ALICE Collaboration)
arXiv:2409.01866 [physics.ins-det]
Detection efficiency and spatial resolution of Monolithic Active Pixel Sensors bent to different radii
ALICE Collaboration
Nuclear Instruments and Methods in Physics Research A 1083 (2026) 171131